Access the right Expertise when You need it
Manufacturing & Technical support
- Inlay line process support : wire embedding (WE), coil winding (CW)
- e-Pass & e-cover line support : teslin / paper inlay, textile/ paper cover
- Lamination process support : recipe, cycle improvement, training
- Production yield analysis and improvement
- Copper wire embedding process
- Technical equipment & material sourcing
- Tender specification support : eGov, eID
- EMV dual interface support : antenna tuning, module embedding process
- and more
SOFTWARE & PERSONALIZATION
- Software development
- Pre-perso & personalization solutions
- Integration of a software platform for any complex test or extended chip encoding sequences
- Design and implementation of customized chip encoding tasks
- Design of customized production test platform for any sheet type format and transponder.
- Advising on security and product certifications (Common Criteria EAL4+/EAL5, EMVCo )
- Tender breakdown incl. gap-analyses and generation of internal specification and To-do lists
- and more
Product development & optimization
- Technical product design support for : Dual interface, contacless, eID, ePass, small form factors
- Antenna tuning design and optimization : RF, Q factor , Hmin, LMA
- Polycarbonate product and process expertise
- Inlay and card structure optimization : reduce the overlays usage for example
- Integration of security feature for eID and eGOV products: see through window, e-datapage Hinge solution
- Failure analysis and improvement
- and more
TURN KEY SOLUTIONS
Our expertise combined with our global network professionals enables us to offer turnkey solutions for complete in-house inlay line design and implementation. We can provide you with a full service assessment solution , as for example :
- Wire embedding inlay line
Design and implementation of an inlay line with wire embedding technology for dual interface, contactless (HF, LF), for different structure type : PC, PVC, Petg, Teslin, Paper. - E-cover gluing line
Design and implementation of passport e-cover gluing process , for paper/ Teslin inlay and Textile/ Paper cover. - Dual interface EMV line :
Antenna tuning and card design to meet the certifications requirements ( EMVco, ISO/IEC), electrical and mechanical compliance. - Integration of Multi-component cards
Support in fine tuning and integration of special and complex products within the standard manufacturing equipment line ( Fingerprint, active cards, and more)
